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Robotics Research
Posted on May 01, 2018

On demand packaging robotic system

Packsize International LLC has announced PackBot™, an industrial service robot that extends right-sized corrugated packaging beyond human limitations. PackBot™, an example of Packsize Global Modular Architecture, is a scalable robotic On Demand Packaging® system that automates the bulk of the manual work on a company's packaging line. Equipped with the PackNet® production and optimization software platform, PackBot™ made its debut at Europe's largest forum for innovative packaging solutions, the new Competence Center Packaging in Langenberg. For more information see the IDTechEx report on new robotics and drones.
 
Adding to its established custom box-making machines and smart packaging systems—PackBot™ addresses top concerns of today's manufacturing and fulfillment managers, such as labor shortages, throughput, and reliability. With Packsize you receive a box making machine, that gives you the power to create a box in any size you need and at exactly the time you need it. By using smaller boxes, on demand packaging users significantly reduce their corrugated cardboard spend. The smallest possible box means there's a reduced need for unsustainable void fillers, eliminating up to 50 percent used and savings on warehouse space, shipping costs and employees.
 
"PackBot™ is at the heart of global trends such as smart manufacturing and warehousing," said Packsize Chief Scientist Niklas Pettersson. "Consumer preference for sustainably packaged products is driving industry focus on packaging optimization, along with manufacturers and distribution center managers who find it increasingly difficult to fulfill manual labor requirements. Through our continued emphasis on sustainable formats and automation, this platform's patented box-erecting process is a true game-changer for On Demand Packaging® systems."
 
Through a proprietary modular engineering approach, PackBot™ can be tailored to meet the customer's specific requirements and made-to-order.
 
Source and top image: Packsize International LLC
Learn more at the next leading event on the topic: Sensors USA 2018 External Link on 14 - 15 Nov 2018 at Santa Clara Convention Center, CA, USA hosted by IDTechEx.