Internet of Things

Autonomous driving, electric vehicles, connected and software-defined vehicles, and in-cabin monitoring are all megatrends reshaping the automotive industry. Together, these technologies combine to form a US$1.6 trillion opportunity by 2034, nearly a 10-fold increase compared to 2023.

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.

Wednesday 17 January 2024 - 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; Market outlook for 2.5D and 3D packaging technologies

Connected and Software-Defined vehicles (SDVs) represent a new paradigm for automakers and consumers. Whereas older ICE vehicles were a conglomeration of 70+ Electronic Control units, kilometers of wiring, and many thousands of components, the new era of vehicles can be more centralized, connected, and convenient, bringing benefits to both the consumer and OEM.

IDTechEx's market research report, "AI Chips for Edge Applications 2024-2034: Artificial Intelligence at the Edge", projects that the global AI chips market for edge devices will grow to US$22 billion by 2034, with the consumer electronics industry vertical taking the largest chunk of this revenue figure, at just over 45% by this date.

Thursday 14 December 2023 - The definition and classification of SDVs, and how they differ from traditional vehicles; The key features and benefits of SDVs, such as over-the-air updates, in-vehicle payments, AI-powered digital assistants, and infotainment; An introduction to Connected Vehicle technologies and terminologies. Key regional regulations related to V2X technology for China, the US, Europe, Japan, South Korea, and India; The main players and partnerships in the V2X ecosystem; An insight into current and forecasted market size and penetration of Connected and Software-Defined Vehicles

Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller, from opening windows to calculating the optimal fuel-air mixture for the current torque demand. But the surface has only just been scratched in terms of how much computing power is making its way into vehicles.

Friday 24 November 2023 - Advanced Semiconductor Packaging: Materials, Technology, Market Outlook - Advanced semiconductor packaging markets and their mid-long-term opportunity; Player analysis - the dynamics of advanced semiconductor packaging battleground; Industry barriers: Manufacturing challenges and material requirements; Research direction for Advanced Semiconductor Packaging

As reported by Nvidia's Q2 financial statement, its second-quarter data center's revenue was a record US$10.32 billion, up 141% from the previous quarter and up 171% from a year ago. With the increasing demand for high-performance servers in data centers, IDTechEx has seen challenges in data center thermal management and tremendous opportunities in this industry.

The road to fully autonomous vehicles is, by necessity, a long and winding one; systems that implement new technologies that increase the driving level of vehicles (driving levels being discussed further below) must be rigorously tested for safety and longevity before they can make it to vehicles that are bound for public streets.