The world of computing is growing in line with increasing demands for problem solving and robotic integration across many major sectors. Quantum computing, semiconductor technologies, and the rise of humanoid robots are some examples of how diverse computing technologies can be, and IDTechEx's portfolio of Quantum Technologies Research Reports and Subscriptions and Semiconductors, Data Centers, AI Research Reports and Subscriptions covers the benefits of computing innovations and some expanding applications.
Climate modelling and material discovery with quantum computing
Quantum computers are known for their ability to solve problems in record time and find solutions that classical computers would fundamentally not be able to. Simulation and optimization are two main buzzwords surrounding quantum computing, as its tools and capabilities are transferable across many sector and applications. Climate modelling is one example of the niche HPC applications that quantum computing could work on, to mimic the Earth's conditions under various circumstances and gain a better understanding of how climate change might affect the planet.
Quantum chemistry with the use of quantum computers could see molecular modelling and drug discovery take off, for new compounds to be made or to find alternatives to existing chemicals that behave the same way. Within aerospace, this approach to material discovery could be hugely beneficial, alongside the physics simulations, aerodynamics, and flight mechanics that quantum computing could also help to achieve. IDTechEx's report, "Quantum Computing Market 2026-2046: Technology, Trends, Players, Forecasts", covers a vast array of quantum computing applications, which highlight the diverse scope of possibilities that could be uncovered as a result of this developing technology. The report predicts that the market for quantum computing hardware could be over the value of US$21 billion by 2046, growing at a compound annual growth rate of 26.7%.
Advanced semiconductor packaging
Other developments within the computing industry include the manufacturing of advanced semiconductor packaging. Bump pitch size is one category that can differentiate advanced semiconductor packaging from regular packaging, whereby the smaller the bump pitch, the greater the interconnection densities and overall package performance. IDTechEx's report, "Advanced Semiconductor Packaging 2027-2037: Forecasts, Technologies, Applications", defines a size at which the bump pitch allows a package to become advanced and includes roadmaps of the evolution of semiconductor packaging along with forecasts for uptake in the future.
IDTechEx identifies bandwidth and power efficiency as two key metrics to determine the performance quality of advanced semiconductor packaging, with the new report also listing various players operating at different stages of package development. These range from 2.5D to 3D and include different technology types such as Si bridge, Si interposer, hybrid bonding, and stacked memories. These ongoing developments across advanced packaging will allow for reduced power consumption, lower costs, and improved computing performance. HPC, autonomous vehicles, and consumer electronics are three of the key markets that advanced semiconductor packaging technologies are targeting, which could benefit from improved connection and bandwidth for faster data processing.
Computers on legs
Robots are taking on lives of their own, though behind the futuristic exteriors, computers still run the show. Humanoid robots in particular are an example of how computers can now walk on two legs and carry out physical work such as contributing to production lines for automotive manufacturing and assembly. There is an increasing desire for humanoids to shift from specialized purposes towards multi-task roles, which IDTechEx states could be expected over the next 5 years. Increasing the scope of work for humanoids may also come from expanding their sensory input. While their vision assists the humanoids with navigation and environment, tactile sensing will allow for dexterous manipulation and delicate tasks.
IDTechEx's report, "Humanoid Robots 2026-2036: Technologies, Markets, and Opportunities", highlights that sensor durability is one barrier to the uptake of tactile sensing in humanoids, alongside data integration and real-time feedback interpretation. The report also includes a timeline of tasks that humanoids may be able to handle over the coming years. Receiving and unloading is expected to be a task for humanoids in 5 to 7 years in line with improvements in AI item recognition and sorting, with packing on a similar timeline. On a slightly shorter timeline, manifesting and labelling, and maintenance and inventory management are tasks expected to see humanoid deployment in 3 to 5 years, as developments in robotic technology develops to become more accurate.
For more information on the diverse world of computing, visit IDTechEx's portfolio of Semiconductors, Data Centers, AI Research Reports and Subscriptions for the latest analyst research.
