6G

In October 2025, Virgin Media (one of the UK's largest telecom operators) signed a landmark partnership with Starlink to provide D2C (direct-to-cell) mobile services from 2026. Although this technology will harness the same satellites as those used for Starlink's satellite Wi-Fi, IDTechEx's latest report on 6G unpacks how D2C mobile services face fundamental physical challenges that will affect their performance compared with satellite Wi-Fi.

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", goes into detail about emerging technologies, including 2.5D and 3D packaging.

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.

Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.

Thursday 14 March 2024 - Exploring Antenna Packaging Technologies: From 5G mmWave to 6G; An overview of antenna packaging technologies for high frequency telecommunication; Antenna packaging strategies for mmWave; Antenna packaging strategies for 6G (beyond 100 GHz)

As the world awaits the full take-off of the next generation of telecommunication technologies, 5G, important stakeholders are preparing for the future of future telecommunications - 6G. This may seem premature, given that deployment of 5G infrastructure and base stations are not nearly at their peak yet.

Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms.

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.

Thursday 15 February 2024 - The Upwards Trajectory of Low-Loss Materials for Future Telecommunications - Identify key factors in 5G deployment affecting demand for low-loss materials; Consider important types of low-loss materials for 5G; Explore trends influencing the development of low-loss materials for 6G; Present IDTechEx's market outlook for the industry